Taiwan's TSMC raises $3.5 billion in bonds for new U.S. plant

by Aurelia Butler 20 April 2022, 00:21 179 Views

TAIPEI (Reuters) – Taiwanese chip firm TSMC has raised $3.5 billon in bonds for its new plant in the U.S. state of Arizona, according to a term sheet.

Taiwan Semiconductor Manufacturing Co Ltd, a major Apple Inc (NASDAQ:AAPL) supplier and the world’s largest contract chip-maker, started construction last year at the Arizona site where it plans to spend $12 billion to build a computer chip factory.

Source: Economy - investing.com

Congress tells SEC redefining long-standing concepts would be bad for digital ecosystem

Netflix estimates 100 million households are sharing passwords and suggests a global crackdown is coming

This portal is not a newspaper as it is updated without periodicity. It cannot be considered an editorial product pursuant to law n. 62 of 7.03.2001. The author of the portal is not responsible for the content of comments to posts, the content of the linked sites. Some texts or images included in this portal are taken from the internet and, therefore, considered to be in the public domain; if their publication is violated, the copyright will be promptly communicated via e-mail. They will be immediately removed.

Taiwan's TSMC raises $3.5 billion in bonds for new U.S. plant

Congress tells SEC redefining long-standing concepts would be bad for digital ecosystem

Netflix estimates 100 million households are sharing passwords and suggests a global crackdown is coming

ITALIAN LANGUAGE

ENGLISH LANGUAGE